Module Lead

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Module Lead - BSP and Driver Design

Module Lead

Position: Module Lead Domain: BSP and Driver Design Business Unit: Product Engineering Services Experience: 3+Years Location: Bangalore Educational Qualification: B.E/B.Tech Skill Sets:
Mandatory
	BSP and Driver design & Development
	Knowledge of Linux Kernel and Driver Architecture.
	Experience with Development/Porting of Linux Kernel and Drivers.

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