"Smaller and faster" are the typical characteristics of today's high performance electronic designs. However, as designs become more efficient and complex in nature designers need to face the challenges of high power densities, potentially higher operating temperatures and reduced reliability.

With component packages being more compact, dissipating more power, and having lower profiles, effective thermal management holds the key to the effective functioning of the system. Thermal management needs to be incorporated at the beginning of the design cycle, effective heat flow management must be planned and thermal resistances minimized.

Mistral's design process ensures thermal analysis of all boards designed, which includes thermal profiling, recommended airflow and re-engineering of the PCB layout for better thermal flow.

This methodology has helped Mistral design boards that work under extremely harsh environmental conditions by incorporating a number of high thermal dissipating, high wattage components.