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CHAMP-XD1
3U VPX Intel Xeon D DSP Processor Card that combines the high core count and floating-point performance of the latest Intel Xeon D processors with the substantial bandwidth and system-enabling features of the VITA 3U OpenVPX form factor.
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Overview
CHAMP-XD1 Digital Signal Processor from Curtiss-Wright is designed for highly compute-intensive industrial, aerospace, and defense applications. This high-performance module, designed for the rigors of Digital Signal Processing (DSP) and emerging machine learning and artificial intelligence applications, delivers incredible processing capability through its 8 or 12-core Intel Xeon D processor.
The CHAMP-XD1 Digital Signal Processor provides Trusted Computing features alongside leading-edge processing technology for unparalleled near real-time processing capability to respond to and protect from threats. The processor board of CHAMP-XD1 includes a core function Field Programmable Gate Array (FPGA) used for TrustedCOTS security and general-purpose I/O in addition to a dedicated Intelligent Platform Management Interface (IPMI) FPGA used for System Monitoring and Health.
The CHAMP-XD1 Digital Signal Processor combines the high core count and floating-point performance of the latest Intel Xeon D processors with the substantial bandwidth and system-enabling features of the VITA 3U OpenVPX form factor. Providing an extended-temperature Intel Xeon D processor with 8 or 12 cores, the CHAMP-XD1 has a peak performance of 410 GFLOPS and 576 GFLOPS respectively. This is complemented by either 16 or 32GB of high-capacity DDR4-2133 memory, boasting an impressive bandwidth exceeding 17GBps per channel across two channels per processor. The CHAMP-XD1 Digital Signal Processor provides a range of options tailored to meet your exact needs, including models designed in accordance with the SOSA Technical Standard or E-OSA specifications.
TECHNICAL SPECIFICATIONS
- Intel Xeon D 8-Core (410 GFLOPS @ 1.6 GHz) or 12-Core (576 @ 1.5 GHz)
- Extended operating temperature Intel eTEMP SKUs
- PCH integrated in Xeon D SoC
- Native dual KR 10 GigE ports
- 16 to 32 GB DDR4 @ 2133 megatransfers per second (34 GB/s aggregate)
- XMC PCIe up to Gen3, designed for up to 25W thermal dissipation
- PCIe Gen3 on 3U OpenVPX data plane with switch
- Core Function FPGA with IPMI
- Conduction and air-cooled