CHAMP-XD2

6U OpenVPX Intel Xeon D DSP Processor Card available in a range of ruggedized configurations to deliver optimal performance in the harshest deployed environments, including air-cooled and conduction-cooled variants.

Overview

CHAMP-XD2 Digital Signal Processor stands out as the sole Dual Xeon D board available, providing exceptional compute density per slot that enables seamless integration of Intel architecture even in the most rugged environments. Curtiss-Wright’s innovative designs enable you to leverage conventional cooling methods alongside cutting-edge techniques and established tools from the realm of high-performance computing. This approach provides you with the requisite power and dimensions while minimizing potential risks and associated expenses.

The 6U OpenVPX Intel Xeon D DSP, CHAMP-XD2 Digital Signal Processor from Curtiss-Wright is available in a range of ruggedized configurations to deliver optimal performance in the harsh deployed environments, and comes in air-cooled and conduction-cooled variants. There is also a resident Core Function Field Programmable Gate Array (FPGA) used for Trusted COTS security and general-purpose I/O in addition to a dedicated Intelligent Platform Management Interface (IPMI) FPGA used for system monitoring and health.

TECHNICAL SPECIFICATIONS

  • Dual processor Xeon D 8-core (820 GFLOPS @ 1.6 GHz total) or 12-core (1152 GFLOPS @ 1.5 GHz total)
  • Extended operating temperature Intel eTEMP SKUs
  • PCH integrated in Xeon D SoC
  • Native dual KX 1 GigE or KR 10 GigE ports on OpenVPX control plane
  • Four ports of 40G/10G Ethernet or DDR/QDR/FDR10 InfiniBand on OpenVPX data plane
  • 16 to 32 GB DDR4 @ 2133 megatransfers per second per Xeon D socket (68 GB/s aggregate)
  • XMC PCIe up to Gen 3, designed for up to 25W thermal dissipation
  • Dual x16 PCIe Gen 3 on OpenVPX expansion plane with switch
  • Core Function FPGA with IPMI
  • Conduction and air-cooled, contact Curtiss-Wright for Air-Flow Through (AFT) options