The term ruggedization is often refers to designs that are tested at high temperatures with high yield fallout. For truly Rugged Designs, boards and systems need to designed for harsh environments from the ground up. For rugeedization, special attention and care needs to be given to component selection; circuit design; printed circuit board (PCB) thickness, layout, and materials; thermal solutions; enclosure and mechanical design; and manufacturing process.
Mistral’s is an embedded product design company offering development of custom industrial and rugged designs and enclosures keeping in mind aesthetics, durability, ruggedization, EMI/EMC protection, safety compliance and product cost.
Mistral has the latest, state-of-the-art 3D CAD systems for industrial and rugged designs, as well as a variety of equipment and tools for mechanical analysis and testing. Our team of experienced engineers with their knowledge and capability in these design tools ensure delivery of Industrial and rugged designs optimized for functionality and manufacturability.
To address the requirements of our aerospace and defense customers, our industrial and rugged designs offer standard hardware architectures which include VPX, OpenVPX, VXS, VME and other VITA and PICMG standards and custom, non-standard hardware. Thermal management is one of the key requirements for ruggedization or rugged design, specifically for aerospace and defense applications that require high processing power. Our rugged designs and system ruggedization process is based on shock, vibration, temperature and Ingress Protection. Our rugged system design or ruggedization services for aerospace and defense applications incorporate the latest air, conduction and AFT techniques to help optimize performance, conform to ATR standards like ½ ATR, ¾ ATR, 1 ATR and support a variety of thermal management methods.
For the consumer market, we offer industrial and rugged designs that are FCC/CE compliant and meet key product considerations like styling and appearance, EMI/EMC protection, thermal cooling for internal components, ruggedization for drop shock and environmental stress, safety compliance and ease of assembly.