Mistral’s expert team has extensive experience in designing High Density Interconnect PCB (HDI PCB) including microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology based techniques.
High Density Interconnect PCB Technology has a higher wiring density per unit area than conventional PCB and are ideal for complex small form factor designs. This advancement in PCB layout and analysis is being driven by the miniaturization of components and semiconductor packages that supports advanced features that are getting utilized in revolutionary new products like wearable electronics, touch screen computing, compact, small footprint gadgets, defense and aerospace applications.
Our expertise also includes handling the power integrity impact while designing using High Density Interconnect PCBs. This includes effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses