Over the past couple of decades we have seen consumer and other electronics devices reducing in weight and size while improving in speed, performance and power consmption. HDI PCB Technology is the one of the leading reasons for this transformation. HDI PCB has a higher wiring density per unit area than conventional PCB and are ideal for complex small form factor designs. A High Density Interconnect PCB contains blind and/or buried vias and quite often contains microvias of .006 or less in diameter. These PCBs have higher circuit density than traditional PCBs. This advancement in PCB layout and analysis is being driven by the miniaturization of components and semiconductor packages that supports a variety of advanced features that are getting utilized in revolutionary new products like wearable electronics, touch screen computing, compact, small footprint gadgets, defense and aerospace applications.
Mistral’s expert team has extensive experience in HDI PCB Layout (High Density Interconnect PCB) including microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology based techniques.
Our expertise also includes handling the power integrity impact while designing using HDI PCB technology. This includes effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses.