High Density Interconnect PCB (HDI PCB)

High Density Interconnect PCB (HDI PCB Technology) designs to help reduce size and weight, as well as enhance electrical performance of embedded devices


Over the past couple of decades we have seen consumer and other electronics devices reducing in weight and size while improving in speed, performance and power consmption. HDI  PCB Technology is the one of the leading reasons for this transformation. HDI PCB has a higher wiring density per unit area than conventional PCB and are ideal for complex small form factor designs. A High Density Interconnect PCB contains blind and/or buried vias and quite often contains microvias of .006 or less in diameter. These PCBs have higher circuit density than traditional PCBs. This advancement in PCB layout and analysis is being driven by the miniaturization of components and semiconductor packages that supports a variety of advanced features that are getting utilized in revolutionary new products like wearable electronics, touch screen computing, compact, small footprint gadgets, defense and aerospace applications.

Mistral’s expert team has extensive experience in HDI PCB Layout (High Density Interconnect PCB) including microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology based techniques.

Our expertise also includes handling the power integrity impact while designing using HDI PCB technology. This includes effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses.


  • Selection of HDI PCB design techniques based on Size, Performance and Components
  • Innovative design methods in Fine Pitch Micro BGA designs
  • Up to 0.37mm BGA pitch designs with 2 mil/2mil track/spacings
  • HDI PCB Designs with stacked and staggered micro-vias
  • Board/System level Signal Integrity, EMI/EMC & Thermal analysis
  • Signal performance analysis for Reflections, Timing, BER, EYE opening
  • DC drop analysis in power supply rails
  • Handling power integrity impact while designing


  • Case Study

    Design and Development of High-Definition, Rugged Digital Video Recorder

  • Case Study

    Small-footprint Hands-free Headset with 15 inch Virtual Display

  • Product Brief

    820 Nano SOM based on Qualcomm SnapDragon SD820 SoC

  • Product Brief

    i.MX6 Nano SOM based on Dual/Quad i.MX6 SoC from NXP

  • Related Topics

    Product Design Services

  • Related Topics

    Small Form Factor Designs