High Density Interconnect PCB (HDI PCB)

Cost-effective HDI PCB Technology (High Density Interconnect PCB) designs including microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad techniques that help reduce size and weight, as well as enhance electrical performance of embedded devices.

OVERVIEW

Over the past couple of decades we have seen consumer and other electronics devices reducing in weight and size while improving phenomenally in speed, performance and power consumption. High Density Interconnect PCB or HDI PCB Technology is one of the leading reasons for this transformation. HDI PCBs have high-density attributes like laser microvias, fine lines and high-performance thin materials. HDI PCB Layout enables more space on a printed circuit board, while making them more efficient and allowing faster transmission.

What is High Density Interconnect PCB?

The increased density in HDI PCBs enables PCB designers to incorporate more functions per unit area.  HDI PCB Layout Designs have a higher wiring density per unit area than conventional PCBs and are ideal for complex small form factor designs. A HDI PCB contains microvias of .006 or less in diameter.  This advancement towards High Density Interconnect PCB Technology in PCB layout and analysis is being driven by the miniaturization of components and semiconductor packages which support a variety of advanced features that are getting utilized in revolutionary new products in applications such as wearable electronics, touch screen computing, compact, small footprint gadgets, defense and aerospace.

HDI PCB Layout Designs

We design cost-effective HDI PCBs using microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology based techniques. Although the microvia process increases the cost of the High Density Interconnect PCB, with proper design and reduction in layer count, we can reduce the cost for material square inches and layer count significantly.

Mistral’s team has extensive experience in designing cost-effective High Density Interconnect PCB Technology designs including microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad techniques that help reduce size and weight, as well as enhance electrical performance of embedded devices. Our HDI PCB Layout Services includes Library management, PCB Layout and Analysis, Power Integrity Analysis Services, Signal Integrity Analysis Services, Structural Analysis Services and Thermal analysis Services.

HDI PCB Manufacturing

Any HDI PCB design and manufacturing requires an advanced level of technical expertise. Our eco-system of PCB and High Density Interconnect PCB manufacturing companies and collaboration with Avalon Technologies, a global ESM company,  enables us to provide our customers with a seamless product and system design experience. Our expertise in High Density Interconnect PCB includes handling the power integrity impact while designing using HDI PCB technology. This includes the effects of the mounted inductance of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pin-outs, and the inherent plane-capacitance changes from using dielectrics of various thicknesses.

Know more about our PCB Layout and Design Expertise.

EXPERTISE

  • Selection of HDI PCB layout techniques based on Size, Performance and Components
  • Innovative design methods in Fine Pitch Micro BGA designs
  • Up to 0.37mm BGA pitch designs with 2 mil/2mil track/spacings
  • HDI PCB Technology Designs with stacked and staggered micro-vias
  • Board/System level Signal Integrity, EMI/EMC & Thermal analysis
  • Signal performance analysis for Reflections, Timing, BER, EYE opening
  • DC drop analysis in power supply rails
  • Handling power integrity impact while designing using High Density Interconnect PCB techniques

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RESOURCES

  • Case Study

    Design and Development of High-Definition, Rugged Digital Video Recorder using HDI PCB Technology

  • Case Study

    HDI PCB layout based Small-footprint Hands-free Headset with 15 inch Virtual Display

  • Product Brief

    820 Nano SOM based on Qualcomm SnapDragon SD820 SoC

  • Product Brief

    i.MX6 Nano SOM based on Dual/Quad i.MX6 SoC from NXP

  • Related Topics

    Product Design Services

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    Small Form Factor Designs

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    Power Integrity Analysis

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    Signal Integrity Analysis

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    PCB Design Services