Over the past couple of decades we have seen consumer and other electronics devices reducing in weight and size while improving phenomenally in speed, performance and power consmption. HDI PCB Technology is the one of the leading reasons for this transformation. HDI PCB Layouts have a higher wiring density per unit area than conventional PCBs and are ideal for complex small form factor designs. A High Density Interconnect PCB contains blind and/or buried vias and quite often contains microvias of .006 or less in diameter. This advancement in PCB layout and analysis is being driven by the miniaturization of components and semiconductor packages that supports a variety of advanced features that are getting utilized in revolutionary new products in wearable electronics, touch screen computing, compact, small footprint gadgets, defense and aerospace applications.
Mistral’s team has extensive experience in designing cost-effective HDI PCB Layout (High Density Interconnect PCB) using microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology based techniques.
Our expertise in High Density Interconnect PCB also includes handling the power integrity impact while designing using HDI PCB technology. This includes effects of mounted inductance of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pin-outs, and the inherent plane-capacitance changes from using dielectrics of various thicknesses.