Over the past couple of decades we have seen consumer and other electronics devices reducing in weight and size while improving phenomenally in speed, performance and power consumption. High Density Interconnect PCB (HDI PCB Technology ) is one of the leading reasons for this transformation. HDI PCB Technology enables more space on a printed circuit board, while making them more efficient and allowing faster transmission.
What is HDI PCB?
HDI PCB Layout has a higher wiring density per unit area than conventional PCBs and are ideal for complex small form factor designs. A High Density Interconnect PCB contains blind and/or buried vias and quite often contains microvias of .006 or less in diameter. This advancement towards High Density Interconnect PCB Technology in PCB layout and analysis is being driven by the miniaturization of components and semiconductor packages which support a variety of advanced features that are getting utilized in revolutionary new products in applications such as wearable electronics, touch screen computing, compact, small footprint gadgets, defense and aerospace.
Mistral’s team has extensive experience in designing cost-effective High Density Interconnect PCB Technology designs including microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad techniques that help reduce size and weight, as well as enhance electrical performance of embedded devices.
We design cost-effective High Density Interconnect PCB using microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology based techniques. HDI PCB design and manufacturing requires an advanced level of technical expertise. Our eco-system of PCB and HDI PCB manufacturing companies and collaboration with Avalon Technologies, a global ESM company, enables us to provide our customers with a seamless product and system design experience. Our expertise in High Density Interconnect PCB includes handling the power integrity impact while designing using HDI PCB technology. This includes the effects of the mounted inductance of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pin-outs, and the inherent plane-capacitance changes from using dielectrics of various thicknesses.