High Density Interconnect PCB

High Density Interconnect PCB (HDI PCB) designs to help reduce size and weight, as well as enhance electrical performance of embedded devices

OVERVIEW

Mistral’s expert team has extensive experience in designing High Density Interconnect PCB (HDI PCB) including microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology based techniques.

High Density Interconnect PCB have a higher wiring density per unit area than conventional PCB and are ideal for complex small form factor designs. This advancement in PCB layout and analysis is being driven by the miniaturization of components and semiconductor packages that supports advanced features that are getting utilized in revolutionary new products like wearable electronics, touch screen computing, compact, small footprint gadgets, defense and aerospace applications.

 

EXPERTISE

  • Selection of design techniques based on Size, Performance and Components
  • Innovative design methods in Fine Pitch Micro BGA designs
  • Up to 0.37mm BGA pitch designs with 2 mil/2mil track/spacings
  • HDI PCB Designs with stacked and staggered micro-vias
  • Board/System level Signal Integrity, EMI/EMC & Thermal analysis
  • Signal performance analysis for Reflections, Timing, BER, EYE opening
  • DC drop analysis in power supply rails
  • Handling power integrity impact while designing

RESOURCES

  • Case Study

    Design and Development of High-Definition, Rugged Digital Video Recorder

  • Case Study

    Small-footprint Hands-free Headset with 15 inch Virtual Display

  • Product Brief

    820 Nano SOM based on Qualcomm SnapDragon SD820 SoC

  • Product Brief

    i.MX6 Nano SOM based on Dual/Quad i.MX6 SoC from NXP

  • Related Topics

    Product Design Services

  • Related Topics

    Small Form Factor Designs